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Patrick Fay

Patrick Fay

Email: pfay@nd.edu

Phone: 574-631-5693

Office: 261 Fitzpatrick Hall

Education

Ph.D, University of Illinois at Urbana-Champaign, 1996

B.S. EE University of Notre Dame, 1991

Biography

Patrick Fay received a Ph.D. in electrical engineering from the University of Illinois at Urbana-Champaign in 1996 after receiving a B.S. in electrical engineering from Notre Dame in 1991. Dr. Fay served as a visiting assistant professor in the Department of Electrical and Computer Engineering at the University of Illinois at Urbana-Champaign in 1996 and 1997, and joined the faculty at the University of Notre Dame in 1997.

Summary of Activities/Interests

Research Interests: Dr. Fay's research interests include the design, fabrication, and characterization of microwave and millimeter-wave electronic devices and circuits, as well as high-speed optoelectronic devices and optoelectronic integrated circuits for fiber optic telecommunications. His research also includes the development and use of micromachining techniques for the fabrication of microwave components and packaging. His educational initiatives include the development of an advanced undergraduate laboratory course in microwave circuit design and characterization, and graduate courses in optoelectronic devices and electronic device characterization. He was awarded the Department of Electrical Engineering's IEEE Outstanding Teacher Award in 1998-1999, and is a senior member of the IEEE. Dr. Fay's interests include high-performance heterostructure devices (e.g., HEMTs, HBTs, and III-V MOSFETs), millimeter-wave detectors and imaging, monolithic microwave integrated circuit (MMIC) design and fabrication, high-speed photodetectors and receivers, photovoltaic devices, and advanced packaging and interconnects. For more details, please visit <a href="http://www.nd.edu/~hscdlab"></a>

Courses: Electronics I, Microwave Circuit Design & Measurements

News

Notre Dame Engineering Announces the First Two Keysight RF and Microwave Industry-Ready Certified Students

January 28, 2016

David Surine and Thomas Zirkle are the first Notre Dame engineering students to be awarded Keysight RF [radio frequency] and Microwave Industry-Ready Student Certification from Keysight Technologies as part of the Keysight RF/Microwave Industry-Ready Student Certification program.

Notre Dame Wireless Institute: Building a Better Phone

January 25, 2016

Every time an individual uses a cell phone, he absorbs some electromagnetic radiation. Each phone must comply with the Federal Communications Commission’s limits on the specific absorption rate of radiation that is considered safe for the body. The key, according to Notre Dame engineers, is being creative in how a phone’s technology can work within these limits.

Fay and Hu Named 2016 IEEE Fellows

December 7, 2015

Patrick Fay and Xiaobo Sharon Hu have been named fellows of the Institute of Electrical and Electronics Engineers, the highest grade of membership conferred by the IEEE Board of Directors upon individual members.

Patrick Fay and Sharon Hu elected to IEEE Fellows

November 24, 2015

For contributions to compound semiconductor tunneling and high-speed device technologies

Notre Dame Spin-out Company Wins Big at International Conference on Microelectronics

December 3, 2014

Indiana Integrated Circuits, LLC (IIC), an Innovation Park-based company that was co-founded by Notre Dame faculty and researchers, has recently been awarded the highly coveted, $150,000 Elevator Pitch Prize from the MEMS (Microelectromechanical Systems) Industry Group. The prize is directed toward fabrication and prototyping services to be provided by MEMs foundry Rogue Valley Microdevices of Medford, Oregon.

Notre Dame Professor Named 2014 Indiana Master of Innovation

November 20, 2014

Gary Bernstein, Frank Freimann Professor of Electrical Engineering and Associate Director of Notre Dame’s Center for Nanoscience and Technology (NDnano), was awarded the inaugural Indiana Master of Innovation Award from the Indiana Economic Development Corporation and Forbes, Inc. for his work on the development of Quilt Packaging (QP) technology.